Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

Тип

Conference proceedings

Издательство

IEEE Computer Society

Коды

ISSN: 2150-5934, ISBN: 9798350384123

Название конференции

18th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2023

Место проведения

Taipei

Дата начала

25.10.2023

Дата окончания

27.10.2023

Список записей

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IDEAL FLOW DESIGN OF THE BENDING OF BI-MATERIAL SHEETS

Article

Rynkovskaya M., Alexandrov S., Moskovskiy A., Tsybin K., Buzin R.

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT. 2023. С. 263-266

COMPARISON OF THROUGH-THICKNESS DAMAGE DISTRIBUTIONS IN SHEETS IN BENDING UNDER TENSION PREDICTED BY SEVERAL EMPIRICAL DUCTILE FRACTURE CRITERIA

Article

Alexandrov S., Rynkovskaya M., Averbukh L., Tikhonov G.

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT. 2024. С. 450-453

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