Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

Type

Conference proceedings

Publisher

IEEE Computer Society

Codes

ISSN: 2150-5934, ISBN: 9798350384123

Conference title

18th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2023

Conference location

Taipei

Start date

25.10.2023

End date

27.10.2023

Records list

Show:

IDEAL FLOW DESIGN OF THE BENDING OF BI-MATERIAL SHEETS

Article

Rynkovskaya M., Alexandrov S., Moskovskiy A., Tsybin K., Buzin R.

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT. 2023. P.. 263-266

COMPARISON OF THROUGH-THICKNESS DAMAGE DISTRIBUTIONS IN SHEETS IN BENDING UNDER TENSION PREDICTED BY SEVERAL EMPIRICAL DUCTILE FRACTURE CRITERIA

Article

Alexandrov S., Rynkovskaya M., Averbukh L., Tikhonov G.

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT. 2024. P.. 450-453

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