Effects of NH3, O2, and N2 co-implantation on Cu out-diffusion and antimicrobial properties of copper plasma-implanted polyethylene

Авторы
Zhang W.1, 2, 4 , Ji J.1 , Yan Q.1 , Zhao J.2 , Chu P.K.2 , Zhang Y. 3 , Kurmaev E.Z.5 , Moewes A. 6
Издательство
Elsevier
Номер выпуска
22
Язык
Английский
Страницы
8981-8985
Статус
Опубликовано
Том
253
Год
2007
Организации
  • 1 Technical Institute of Physics and Chemistry|Chinese Academy of Sciences
  • 2 Department of Physics and Materials Science|City University of Hong Kong
  • 3 Graduate School|the Chinese Academy of Sciences
  • 4 School of Materials Science and Technology|China University of Geosciences
  • 5 Institute of Metal Physics|Russian Academy|Sciences-Ural Division
  • 6 Department of Physics and Engineering Physics|University of Saskatchewan
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Другие записи

Boukhvalov D.W., Kurmaev E.Z., Galakhov V.R., Finkelstein L.D., Al-Saqer M., Dobrovitski V.V., Harmon B.N., Moewes A., Chiuzbǎian S., Neumann M., Katsnelson M.I., Lichtenstein A.I., Endo K., North J.M., Dalal N.S.
Physical Review B - Condensed Matter and Materials Physics. Том 75. 2007. 014419 с.