Effects of NH3, O2, and N2 co-implantation on Cu out-diffusion and antimicrobial properties of copper plasma-implanted polyethylene

Zhang, W.; Ji, J.; Yan, Q.; Zhao, J.; Chu, P.K.; Zhang, Y.; Kurmaev, E.Z.; Moewes, A.

Авторы

Zhang W. ^1, ^2, ⁴ , Ji J. ¹ , Yan Q. ¹ , Zhao J. ² , Chu P.K. ² , Zhang Y. ³ , Kurmaev E.Z. ⁵ , Moewes A. ⁶

Журнал

Прикладная наука о поверхности (Applied Surface Science)

Издательство

Elsevier

Номер выпуска

Язык

Английский

Страницы

8981-8985

Статус

Опубликовано

Том

253

Год

2007

Организации

¹ Technical Institute of Physics and Chemistry|Chinese Academy of Sciences
² Department of Physics and Materials Science|City University of Hong Kong
³ Graduate School|the Chinese Academy of Sciences
⁴ School of Materials Science and Technology|China University of Geosciences
⁵ Institute of Metal Physics|Russian Academy|Sciences-Ural Division
⁶ Department of Physics and Engineering Physics|University of Saskatchewan

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