Rynkovskaya M.

Vietnam Journal of Science and Technology. Publishing House of Natural Science and Technology, VAST. Том 62. 2024. С. 184-194

Journal of Physics: Conference Series. Institute of Physics Publishing. Том 2878. 2024.

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT. IEEE Computer Society. 2023. С. 263-266

WSEAS Transactions on Applied and Theoretical Mechanics. World Scientific and Engineering Academy and Society. Том 18. 2023. С. 318-326

Computers and Electrical Engineering. Elsevier Ltd. Том 99. 2022.

Computation. MDPI. Том 10. 2022.

Curved and Layered Structures. De Gruyter Open Ltd. Том 8. 2021. С. 61-69

Processes. MDPI. Том 9. 2021.

Advances in the Astronautical Sciences. Univelt Inc.. Том 174. 2021. С. 809-816

Applied Mathematical Modelling. Elsevier Inc.. Том 94. 2021. С. 676-687

Advanced Structured Materials. Springer Verlag. Том 124. 2020. С. 309-320

Advanced Structured Materials. Springer Verlag. Том 113. 2020. С. 95-104

Materials Science Forum. Trans Tech Publ, Uetikon-Zuerich, Switzerland. Том 986 MSF. 2020. С. 78-85

Advances in the Astronautical Sciences. Univelt Inc.. Том 170. 2020. С. 741-753

International Journal of Mechanical Engineering and Robotics Research. International Journal of Mechanical Engineering and Robotics Research. Том 9. 2020. С. 696-700