Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT.
IEEE Computer Society.
2023.
С. 263-266
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Тип
Сборник материалов конференции
Издательство
IEEE Computer Society
Коды
ISSN: 2150-5934, ISBN: 9798350384123
Название конференции
18th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2023
Место проведения
Taipei
Дата начала
25.10.2023
Дата окончания
27.10.2023
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Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT.
IEEE Computer Society.
2024.
С. 450-453
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