Stepanov N., Turlikov A., Begishev V., Koucheryavy Y., Moltchanov D.
MmNets 2021 - Proceedings of the 5th ACM Workshop on Millimeter-Wave and Terahertz Networks and Sensing Systems, Part of ACM MobiCom 2021.
Association for Computing Machinery, Inc.
2021.
С. 37-42
Yang M., Zhu H., Wang H., Koucheryavy Y., Samouylov K., Qian H.
ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings.
Institute of Electrical and Electronics Engineers Inc..
Том 2020-May.
2020.
С. 5035-5039
Khakimov A., Poluektov D., Mokrov E., Koucheryavy Y., Samouylov K.
3rd International Science and Technology Conference "Modern Network Technologies 2020", MoNeTeC 2020 - Proceedings.
Institute of Electrical and Electronics Engineers Inc..
2020.
Daraseliya A., Korshykov M., Sopin E., Moltchanov D., Koucheryavy Y., Samouylov K.
IEEE International Symposium on Personal, Indoor and Mobile Radio Communications, PIMRC.
Institute of Electrical and Electronics Engineers Inc..
Том 2020-August.
2020.
Kovalchukov R., Samuylov A., Moltchanov D., Ometov A., Andreev S., Koucheryavy Y., Samouylov K.
2017 IEEE Global Communications Conference, GLOBECOM 2017 - Proceedings.
Institute of Electrical and Electronics Engineers Inc..
Том 2018-January.
2018.
С. 1-7
Orsino A., Ometov A., Fodor G., Moltchanov D., Militano L., Andreev S., Yilmaz O.N.C., Tirronen T., Torsner J., Araniti G., Iera A., Dohler M., Koucheryavy Y.
IEEE Communications Magazine.
Institute of Electrical and Electronics Engineers Inc..
Том Vol 55 Issue 2.
2017.
С. 79-87
Gapeyenko M., Samuylov A., Gerasimenko M., Moltchanov D., Singh S., Aryafar E., Yeh S.-P., Himayat N., Andreev S., Koucheryavy Y.
Материалы международной конференции: Communications (ICC), 2016 IEEE International Conference on, 22-27 May 2016, ,DOI: 10.1109/ICC.2016.7511572. Проиндексировано в Scopus..
[б.и.].
2016.
С. 1-7
Ometov A., Orsino A., Militano L., Moltchanov D., Araniti G., Olshannikova E., Fodor G., Andreev S., Olsson T., Iera A., Torsner J., Koucheryavy Y., Mikkonen T.
IEEE Wireless Communications.
Institute of Electrical and Electronics Engineers Inc..
Том Vol 23 Issue 4.
2016.
С. 103-111