Effects of NH3, O2, and N2 co-implantation on Cu out-diffusion and antimicrobial properties of copper plasma-implanted polyethylene

Authors
Zhang W. 1, 2, 4 , Ji J. 1 , Yan Q. 1 , Zhao J. 2 , Chu P.K. 2 , Zhang Y. 3 , Kurmaev E.Z. 5 , Moewes A. 6
Publisher
Elsevier
Issue number
22
Language
English
Pages
8981-8985
State
Published
Volume
253
Year
2007
Organizations
  • 1 Technical Institute of Physics and Chemistry|Chinese Academy of Sciences
  • 2 Department of Physics and Materials Science|City University of Hong Kong
  • 3 Graduate School|the Chinese Academy of Sciences
  • 4 School of Materials Science and Technology|China University of Geosciences
  • 5 Institute of Metal Physics|Russian Academy|Sciences-Ural Division
  • 6 Department of Physics and Engineering Physics|University of Saskatchewan
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Boukhvalov D.W., Kurmaev E.Z., Galakhov V.R., Finkelstein L.D., Al-Saqer M., Dobrovitski V.V., Harmon B.N., Moewes A., Chiuzbǎian S., Neumann M., Katsnelson M.I., Lichtenstein A.I., Endo K., North J.M., Dalal N.S.
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