Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT.
IEEE Computer Society.
2023.
P. 263-266
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Type
Conference proceedings
Publisher
IEEE Computer Society
Codes
ISSN: 2150-5934, ISBN: 9798350384123
Conference title
18th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2023
Conference location
Taipei
Date of begin
25.10.2023
Date of end
27.10.2023
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT.
IEEE Computer Society.
2024.
P. 450-453
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